By the end of June, Chipchain completed its 2nd round financing that was jointly invested by an A-share listed company and a Hong Kong listed company in the industry. The total amount of financing has reached tens of millions US dollars.
Founded on January 10, 2018, Shenzhen Chipchain Technologies Co., Ltd. was headquartered in Nanshan Science and Technology Park, and later moved to Longgang District according to its support policies to IC industry. In March 2018, Chipchain established an affiliate company in Taipei, which has established extensive and in-depth relationships with the Taiwan semiconductor industry and has achieved a certain influence.
Chipchain is committed to providing one-stop services with complete design processes which include specification definition, chip design, wafer tape-out, packaging/testing and etc. Products range from ASICs such as Blockchain, IoT, AI and etc to SoCs, Chipchain has accumulated rich successful tape-out experiences, especially in the design of ultra-low power and high-performance computing chips. The key to provide customers with intelligent, efficient and on-time chip services lies in our capabilities of chip design capabilities of advanced process from 40nm to 6nm and complete supply chain management.
Chip Design Services
- Chipchain is capable of providing customers with services of all processes from specification definition to mass production, including architecture planning, algorithm optimization, front-end design, verification, back-end design, tape-out, packaging and testing.
IP Licensing Services
- We can provide various integer, decimal, spread spectrum and linear frequency modulation phase-locked loops (PPL).
- low dropout regulators (LDO).
- voltage sensors and temperature sensors.
- We can provide standard cell library customization service, including ultra-low voltage library characterization, multi-bit DFF design etc.
IoT Series Chips
Chipchain conducts the R&D of a series of IoT single chips focusing on the control, voice, images and edge computing functions. By designing low-power, high-performance, small-size, highly integrated, safe and stable IoT application chips, we strive to provide the most complete IoT solutions. At present, the first chip C100 which is applied for the control and interconnection of IoT is under development.
The chip C100 developed by Chipchain is a single chip with high integration, low power consumption and high performance used in the field of IoT applications. It has an enhanced 32-bit RISC-V CPU (frequency up to 1.5GHz) and is embedded RAM and ROM storage units, which can provide efficient processing and computing capabilities. C100 integrates Wi-Fi, ADC, LDO, temperature sensor, multiple types of transmission interfaces, etc., which can provide customers with a wider range, simpler and faster development and application.
Toys and Games
Chipchain and TSMC have announced the signing of a cooperation agreement for 7nm FinFET process technology, which covers the design of low-power, high-performance computing ASICs.
After TSMC’s licensing of 16nm process PDK, Chipchian’s R&D team took about 4 months to quickly complete the design, optimization and verification. The GDS data was submitted to TSMC and Chipchian carried 16nm MPW Shuttle for tape-out on November 6, 2018.