By the end of June, Chipchain completed its 2nd round financing that was jointly invested by an A-share listed company and a Hong Kong listed company in the industry. The total amount of financing has reached tens of millions US dollars.
Chipchain and TSMC have announced the signing of a cooperation agreement for 7nm FinFET process technology, which covers the design of low-power, high-performance computing ASICs.
After TSMC’s licensing of 16nm process PDK, Chipchian’s R&D team took about 4 months to quickly complete the design, optimization and verification. The GDS data was submitted to TSMC and Chipchian carried 16nm MPW Shuttle for tape-out on November 6, 2018.
After obtaining the licensing of 16nm FinFET process technology and successfully setting up an account in TSMC last month, Chipchain was provided the PDK of 12nm FinFET process technology by TSMC today, which illustrated TSMC’s recognition of the technical strength of Chipchain.
Today, Chipchain and TSMC signed a technology licensing agreement. According to the agreement, TSMC will license the PDK of 16nm FinFET process technology to Chipchain, and Chipchain will officially set up a cooperation account in TSMC.
In order to establish a good and efficient cooperative relationship with the supply chain in the semiconductor industry, Chipchain has been planning to set up a local company in Taiwan.