Chipchain Completed the 2nd Round Financing and Carried Out 16nm Full-mask Tape-out in TSMC

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Chipchain Completed the 2nd Round Financing and Carried Out 16nm Full-mask Tape-out in TSMC

By the end of June, Chipchain completed its 2nd round financing that was jointly invested by an A-share listed company and a Hong Kong listed company in the industry. The total amount of financing has reached tens of millions US dollars.

At the end of 2018, Chipchain carries out the first 16nm MPW at TSMC and achieved success. After several months of design optimization, at the end of this month, nearly 4 million US dollars was paid to TSMC for the full-mask tape-out.

According to TSMC, compared with the 28nm process, the integration density of the 16nm transistor is doubled, the operating speed of the transistor can be increased by 35%, and the power consumption can be reduced by 55%.

With the improvement of the process node in the fab, Chipchain will continue to break through its own R&D technologies and the power consumption in 16nm products will be more superior.